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Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
? BV DSS
? T J
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
V GS = 0 V, I D = –250 μ A
I D = –250 μ A, Referenced to 25 ° C
–60
–57
V
mV/ ° C
I DSS
I GSS
Zero Gate Voltage Drain Current
Gate–Body Leakage,
V DS = –48 V,
V GS = ± 20 V,
V GS = 0 V
V DS = 0 V
–1
± 100
μ A
nA
On Characteristics
(Note 2)
V GS(th)
? V GS(th)
? T J
R DS(on)
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
V DS = V GS , I D = –250 μ A
I D = –250 μ A, Referenced to 25 ° C
V GS = –10 V, I D = –0.34 A
–1
–1.9
3.2
1.2
–3.5
5
V
mV/ ° C
?
On–Resistance
V GS = –4.5 V, I D = –0.25 A
V GS = –10 V,I D = –0.34 A, T J =125 ° C
1.5
1.9
7.5
10
I D(on)
On-State Drain Current
V GS = –10 V V DS = –10 V
–1
A
g FS
Forward Transconductance
V DS = –10 V,
I D = –0.34 A
700
mS
Dynamic Characteristics
C iss
C oss
C rss
R G
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = –25 V,
f = 1.0 MHz
V GS = 15mV,
V GS = 0 V,
f = 1.0 MHz
66
13
6
11.2
pF
pF
pF
?
Switching Characteristics
(Note 2)
t d(on)
t r
t d(off)
t f
Q g
Q gs
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Total Gate Charge
Gate–Source Charge
V DD = –25 V,
V GS = –10 V,
V DS = –25 V,
V GS = –10 V
I D = –1 A,
R GEN = 6 ?
I D = –0.34 A,
3.2
10
8
1
1.6
0.3
6.4
20
16
2
2.2
ns
ns
ns
ns
nC
nC
Q gd
Gate–Drain Charge
0.3
nC
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Sourc e Diode Forward Current
– 0.34
A
V SD
Drain–Source Diode Forward
Voltage
V GS = 0 V, I S = –0.34 A (Note 2)
–0.8
–1.4
V
Notes:
1. R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
on a .005 in pad of 2 oz
a) 130 ° C/W when
mounted on a 0.125
in 2 pad of 2 oz.
copper.
b) 140°C/W when mounted
2
copper
c) 180°C/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 μ s, Duty Cycle < 2.0%
NDC7003P Rev B(W)
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